According to different applications, different dimensions, heat dissipation schemes and luminous effects. The LED packaging forms are divided into seven paragraphs: pin type, power type packaging, surface mount type (SMD), chip-on-board (COB), Chip-LED, UVC metal, and ceramic packaging.
The LED foot package uses lead frames as the pins of various package shapes. It is the first package structure successfully developed and put on the market. There are many varieties and high technology maturity. The internal structure and reflective layer of the package are still being improved. The commonly used 3-5mm package structure is generally used for LED packages with low current (20-30mA) and low power (less than 0.1W). It is mainly used for instrument display or indication, and it can also be used as a display screen during large-scale integration. The disadvantage is that the thermal resistance of the package is large (generally higher than 100K/W), and the life is short.
LED chips and packaging are developing towards high power. Under high current, the luminous flux is 10 to 20 times larger than that of Φ5mm LED. Effective heat dissipation and non-deteriorating packaging materials must be used to solve the problem of Slim Fin Series LED High Bay Light attenuation. Therefore, the shell and packaging are also the key. Technology, LED packages that can withstand several watts of power have appeared. 5W series of white, green, blue-green, blue power LEDs have been supplied since the beginning of 2003. The light output of white LEDs reaches 1871m, and the luminous efficiency is 44.31 lm/W. The green light decay problem has been developed, and LEDs that can withstand 10W power have been developed. Tube; the size is 2.5mm X2.5mm, it can work at 5A current, and the light output can reach 2001lm. It has great development space as a solid-state lighting source.
As early as 2002, surface mount packaged LEDs (SMDLEDs) were gradually accepted by the market and gained a certain market share. The shift from pin-type packaging to SMD was in line with the development trend of the entire electronics industry, and many manufacturers launched such products.
SMD LED is currently the packaging structure with the highest market share in the LED market. This LED packaging structure uses the injection molding process to wrap the metal lead frame in PPA plastic and form a reflective cup of a specific shape. The metal lead frame extends from the bottom of the reflective cup to the side of the device. , forming device pins by flattening outwards or bending inwards. The improved SMDLED structure is accompanied by white LED lighting technology. In order to increase the power of a single LED device and improve the brightness of the device, engineers began to look for ways to reduce the thermal resistance of SMDLEDs, and introduced the concept of heat sink. This improved structure reduces the height of the original SMD LED structure. The metal lead frame is directly placed on the bottom of the LED device, and the reflective cup is formed around the metal frame by injecting plastic. The chip is placed on the metal frame, and the metal frame is soldered directly to the A vertical cooling channel is formed on the circuit board. Due to the development of material technology, SMD packaging technology has overcome the early problems such as heat dissipation and service life, and can be used to package high-power white LED chips of 1-3W.
COB packaging can directly package multiple chips on the metal-based printed circuit board MCPCB, and directly dissipate heat through the substrate, which not only reduces the manufacturing process and cost of the bracket, but also has the advantage of reducing thermal resistance for heat dissipation. The PCB board can be a low-cost FR-4 material (glass fiber reinforced epoxy resin), or a metal matrix or ceramic matrix composite material with high thermal conductivity (such as an aluminum substrate or a copper-clad ceramic substrate, etc.). For wire bonding, thermosonic bonding at high temperature (gold wire ball bonding) and ultrasonic bonding at room temperature (aluminum wedge bonding) can be used. COB technology is mainly used for high-power multi-chip array LED packaging. Compared with SMD, it not only greatly improves the packaging power density, but also reduces the packaging thermal resistance (generally 6-12W/m·K).
From the perspective of cost and application, COB will become the mainstream direction of lighting design in the future. COB-packaged LED modules are equipped with multiple LED chips on the base plate. The use of multiple chips can not only improve the brightness, but also help to achieve a reasonable allocation of LED chips, reducing the input current of a single LED chip to ensure high efficiency. Moreover, this surface 6-Leaf High Power LED High Bay Light source can greatly expand the heat dissipation area of the package, making it easier to conduct heat to the housing. The traditional method of LED lamps is: LED light source discrete device – MCPCB light source module – LED lamps, mainly based on the lack of applicable core light source components, which is not only labor-consuming and time-consuming, but also high cost. In fact, if you take the route of “COB light source module-LED lamps”, you can not only save labor and time, but also save the cost of device packaging.
Taiming Optoelectronics LED packaging series has very thin surface mount (SMT Assembly) light-emitting diodes. The high-brightness chips used in low-power LEDs are only the size of a pencil head. It achieves excellent lighting functions with minimal power consumption and has high The advantages of brightness and small size are very suitable for working with various small products in harsh environments. LEDs enable designers to increase design flexibility and achieve high performance in applications such as navigation systems, mobile phones, industrial control systems, backlit keypads and displays for traffic lights and message boards.
The continuous heating up of UVC LED has made the market hot. Everyone knows that UVC LEDs have remarkable sterilization and disinfection effects. Thermal management is the key to improving the life of UVC LEDs. Effective LED backsides become the only way to effectively dissipate heat. At present, UVC LEDs on the market basically use flip-chips with high thermal conductivity aluminum nitride substrates. host. Aluminum nitride (AIN) has excellent thermal conductivity (140W/mK-170W/mK), can withstand the aging of the ultraviolet light source itself, and meets the needs of UVC LED high heat management. Taiming Optoelectronics adopts gold-tin eutectic soldering and is at the leading level in the industry. Eutectic soldering with flux can effectively improve the bonding strength and thermal conductivity of the chip and the substrate, which is beneficial to the quality control of UVC LEDs. It has excellent heat dissipation effect, long product life and excellent product quality control
In 2016, China developed and independently developed fluorescent ceramic white light high-power packaging technology, which solved the common problems of thermal management and packaging material failure in LED high-power lighting. A LED lamp with a 1000W light source has been successfully packaged, and the area of the entire light source chip is only a little larger than a 1 yuan coin. And in the lighting of the Beijing 2018 Beijing Winter Olympics training venues, replacing 2000W metal halide lamps. Using ceramics as packaging materials can significantly reduce power consumption and carbon emissions, and the average power saving rate can reach about 70%.
“Take the replacement of 1000W 140lm~150/w LED Stadium Floodlight by 300W transparent fluorescent ceramic packaged LED high bay lamp as an example: 1000W metal halide lamp is about 2000 yuan, and its service life is about 1 year. 5 years. If the replacement is calculated by using 10 hours a day, the cost can be recovered in 1 year, and 12,000 kWh of electricity can be saved in 5 years.”
Wandan Lighting can solve it for you. According to the needs of LED downstream lighting manufacturers, whether it requires single-device packaging or modular COB packaging, from small power to high power, how to reduce the thermal resistance of the device from the design of the LED packaging structure, To improve the light effect and improve reliability. Develop a series of product solutions for it, and export technology and technology services.
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